Tecnalia. Inspiring Business

Tecnalia. Inspiring Business

Zaha Hadid Architects, Rafael de la Hoz and many more await you in ICAE 2015 Congress. Come and live it!


ICAE 2015 will be held at the Kursaal Cogress Palace in Donostia – San Sebastián (SPAIN) on the 27th to 29th May.

TECNALIA  will meet at Kursaal Congress Palace in Donostia – San Sebastián (SPAIN) on the 27th to 29th May 2015 the main European experts on architectural envelopes innovation. During three days the Congress will become the meeting point to know the latest trends, product, solutions and market achievements thanks to the contribution or more than 70 acknowledged lecturers.

During the Congress, acknowledged architects and specialised consultancy offices are presenting theirs latest projects: Uli Blum (Zaha Hadid Architects), Edouard Gillon (WATG), Rob Henderson (UNStudio), Alex de Jong (OMA), Rafael de la Hoz, Jesús Cerezo, Xavier Ferrés, Damian Rogan y Lisa Rammig (Eckersley O'Callaghan), Stefan Marinitsch (SEELE GmbH), Carles Teixidor (Bellapart)….

In this seventh edition, the commitment with the indsutry is kept thanks to the relevant number of sponsors and lectures by Patrick England (FAEFC, Asociación Europea de Fabricantes de Fachadas), Jos Lenferik (VEKA), Max Radt (WICONA-SAPA), Thiemo Ebbert (Kawneer)

Finally, the Research and Development activities are shown in a more important way with the participation of Lorenzo Vallés, from the European Commission D. G. Research, Ulrich Knaack (TU Delft), and the AMANAC cluster, the cluster of all the Advanced Material and nanotechnology projects under 7th Frame Programme of the European Commission: 26 projects and 255 project partners.

“This seventh edition is quite different, that is why we have achieved and excellent programme with a focus on the more relevant aspect to discuss about the smart facades and adaptable envelopes and to show recent case studies”, Julen Astudillo, Chairman of the Organising Committee.

ICAE2015 is organised by TECNALIA, with the sporsorship of Alucoil, Aluman, ArcelorMittal, Dekton, Dow Corning, Rockwool, Saint Gobain, Parex, Sika, Strow, Veka, and Wicona and the collaboration of the Asociación Española de Fabricantes de Fachadas Ligeras y Ventanas (ASEFAVE), AMANAC (Advanced Material & Nanotechnology Cluster for Energy Efficiency in Buildings), the European Construction Technology Platform (ECTP), the European Steel Technology Platform (ESTEP), the European Façade Network, the Federation of European Window and Curtain Wall Manufacturers´ Association (FAECF), the Basque Government, the Plataforma Tecnológica Española del Acero (PLATEA) and the Plataforma Tecnológica Española de Construcción (PTEC).

TECNALIA offers a comprehensive relationship as technology partner for the industry on development, characterisation and performance assessment of architectural envelopes.

More information

Sigue en contacto con Tecnalia


Tecnalia - Inspiring Business



© 2019 Tecnalia. All rights reserved.

Parque Científico y Tecnológico de Bizkaia. Astondo Bidea, Edificio 700. E-48160 Derio. Bizkaia (Spain). Tel.: 902.760.000 - International Calls: (+34) 946.430.850