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Tecnalia. Inspiring Business

Tecnalia. Inspiring Business

Closing of the seventh edition of the International Congress of Architectural Envelopes (ICAE 2015) organized by TECNALIA

2015.06.12

The event achieved more than 300 professionals representing more than 150 entities

The closing event of the seventh edition of the International Congress on Architectural Envelopes (ICAE 2015) organized by TECNALIA was held on May 29th with the satisfaction of have met the expectations of participants, providing a networking opportunity for the exchange of experiences and discussion but furthermore to strengthen the relationships between the stakeholders of the façade industry.

During three days, ICAE 2015 was the meeting point to know the latest trends of the sector, products, solutions and successful cases studies in the market; moreover the event main achievements are shown as follows:

  • 300 participants from more than 150 entities.
  • 45% of the participants, from industrial companies related to the envelope, 10% specifiers (architects and consulting engineers), 41% researchers and 4%, members of sector associations.
  • Regarding the international participation there were participants coming from France, Italy,  Germany, U.K., Holland, Belgium, USA, Turkey, Sweden, Finland, Denmark… and, of course, form Spain.
  •  More than 70 lectures were presented.
  • 12 industrial sponsors with their own stands.

Along the Congress, international acknowledged lecturers have participated, delivering a lot of relevant moments. Some lectures to be underlined were those delivered by Lorenzo Valles (European Commission, DG Research), Uli Blum (Zaha Hadid Architects), Ulrich Knaack (TU Delft), Edouard Gillon (WATG), Rob Henderson (UN Studio), Alex de Jong (OMA), Jesús Román (Estudio Rafael de la Hoz), Jesús Cerezo (ENAR Envolventes), Xavier Ferrés (Ferrés Arquitectos), Pablo Garrido (Universitat Politècnica de Catalunya), Lisa Rammig (Eckersley O´Callaghan), Guruprakash Sastry (Infosys), Stefan Marinitsch (Seele Gmbh), Francesc Arbós (Bellapart), Patrick England (Federation of European Window and Curtain Wall Manufacturers’ Association FAEFC ), Jos Lenferik (VEKA), Max Radt (Wicona), researchers from TECNALIA and many more.

To illustrate these results, we take this opportunity to make available the PHOTO ALBUM to share the most memorable moments of the congress. 

We have to emphasize the commitment of the industry of architectural envelopes, materialized through its contributions through presentations and with the sponsorship of Alucoil, Aluman, ArcelorMittal, Dekton, Dow Corning, Rockwool, Saint Gobain, Parex, Sika, Strow, Veka, and Wicona and the collaboration of the Spanish Association of Window and Curtain Wall Manufacturers (ASEFAVE), VETECO, AMANAC (Advanced Material & Nanotechnology Cluster for Energy Efficiency in Buildings), the European Construction Technology Platform (ECTP), the European Steel Technology Platform (ESTEP), the European Façade Network, the Federation of European Window and Curtain Wall Manufacturers´ Association (FAECF), the Basque Government, the  Spanish Steel Technology Platform (PLATEA) and the Spanish Construction Technology Platform (PTEC).

TECNALIA organizes this international congress every three years, completing its offering a comprehensive relationship as technological partner for the industries on development, characterisation and performance assessment of architectural envelopes. Should you wish to obtain further information about TECNALIA capabilities and offer regarding Architectural Envelopes please access to our portfolio.


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